Stats Chippac Pte. Ltd.

Jae Chang Kim

Hyeog Chan Kwon

Jong Wook Ju

Taeg Ki Lim

Hyun Joung Kim

Koo Hong Lee

Myung Kil Lee

Byung Ok Kim, Legal Representative

A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.

Integrated circuit package system including honeycomb molding

An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.

Integrated circuit package system with internal stacking module adhesive

An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.

Growing community of inventors

Changwon, South Korea

Jae Chang Kim