The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Feb. 04, 2008
Myung Kil Lee, Seoul, KR;
Jae Chang Kim, Changwon-si, KR;
Byung OK Kim, Legal Representative, Changwon-si, KR;
Koo Hong Lee, Seoul, KR;
Myung Kil Lee, Seoul, KR;
Jae Chang Kim, Changwon-si, KR;
Byung Ok Kim, legal representative, Changwon-si, KR;
Koo Hong Lee, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile