IDiyas

For the Inventor, By the Inventor

Seoul, South Korea

Koo Hong Lee

USPTO Granted Patents = 18 

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 59(Granted Patents)


Company Filing History:

goldMedal18 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2009-2017

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18 patents (USPTO):Explore Patents
1. 9768102 - Integrated circuit packaging system with support structure and method of manufacture thereof (2017-09-19),
2. 8710675 - Integrated circuit package system with bonding lands (2014-04-29),
3. 8481371 - Thin package system with external terminals and method of manufacture thereof (2013-07-09),
4. 8471374 - Integrated circuit package system with L-shaped leadfingers (2013-06-25),
5. 8432026 - Stackable multi-chip package system (2013-04-30),
6. 8410594 - Inter-stacking module system (2013-04-02),
7. 8125076 - Semiconductor package system with substrate heat sink (2012-02-28),
8. 8067272 - Integrated circuit package system for package stacking and manufacturing method thereof (2011-11-29),
9. 8026582 - Integrated circuit package system with internal stacking module adhesive (2011-09-27),
10. 8012867 - Wafer level chip scale package system (2011-09-06),
11. 7947535 - Thin package system with external terminals (2011-05-24),
12. 7915738 - Stackable multi-chip package system with support structure (2011-03-29),
13. 7915724 - Integrated circuit packaging system with base structure device (2011-03-29),
14. 7736950 - Flip chip interconnection (2010-06-15),
15. 7683467 - Integrated circuit package system employing structural support (2010-03-23),

Title: Koo Hong Lee: Innovator in Integrated Circuit Packaging

Introduction

Koo Hong Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 18 patents. His innovative work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents, Koo has developed an integrated circuit packaging system with a support structure and a method of manufacture. This method involves forming a one-layer substrate with a symmetrical structure, which includes a redistribution pad and insulation. The redistribution pad is located only at the top side of the insulation. The process includes mounting an integrated circuit over the substrate and forming an encapsulation over the integrated circuit. Another notable patent is for an integrated circuit package system with bonding lands. This system features a first integrated circuit die with die pads adjacent to a single edge, forming first bonding lands that connect the die pads and encapsulate them to create a first package.

Career Highlights

Koo Hong Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuits. His work has been instrumental in developing new packaging technologies that enhance the performance of electronic components.

Collaborations

Koo has collaborated with several talented individuals in his field, including Young Cheol Kim and Jae Hak Yee. These collaborations have fostered a creative environment that has led to groundbreaking advancements in integrated circuit technology.

Conclusion

Koo Hong Lee's contributions to integrated circuit packaging have established him as a leading inventor in the industry. His innovative patents and collaborative efforts continue to shape the future of electronic device technology.

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