The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Sep. 28, 2007
Jong-woo Ha, Seoul, KR;
Koo Hong Lee, Seoul, KR;
Soo Won Lee, AnYang-Si, KR;
Juhyun Park, Seoul, KR;
Zigmund Ramirez Camacho, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Jong-Woo Ha, Seoul, KR;
Koo Hong Lee, Seoul, KR;
Soo Won Lee, AnYang-Si, KR;
JuHyun Park, Seoul, KR;
Zigmund Ramirez Camacho, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.