Jong-Woo Ha

This inventor holds 52 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignee: Stats Chippac Pte. Ltd.. Active years: 2007-2016.

USPTO Granted Patents = 52 (Patent Applications = 2)

% Patents Active = 98.1

Average Co-Inventor Count = 3.0

ph-index = 11

Forward Citations = 444(Granted Patents)

Forward Citations (Not Self Cited) = 432(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

52 out of 1,842

Stats Chippac Pte. Ltd.

patents

Years Active: 2007-2016

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Areas of Expertise:

Integrated Circuit

Packaging System

Multi-Chip Module

Stacked Configuration

Redistribution Layer

Cavity Package

Wafer Scale

Die Stacking

Ball Grid Array

Lead Frame

Embedded Circuitry

Offset Stacking

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9355962 - Integrated circuit package stacking system with redistribution and method of manufacture thereof (2016-05-31),

2. 9330945 - Integrated circuit package system with multi-chip module (2016-05-03),

3. 9236319 - Stacked integrated circuit package system (2016-01-12),

4. 9230898 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2016-01-05),

5. 8987056 - Integrated circuit package system with support carrier and method of manufacture thereof (2015-03-24),

6. 8957530 - Integrated circuit packaging system with embedded circuitry and post (2015-02-17),

7. 8823160 - Integrated circuit package system having cavity (2014-09-02),

8. 8810018 - Stacked integrated circuit package system with face to face stack configuration (2014-08-19),

9. 8692388 - Integrated circuit package system with waferscale spacer (2014-04-08),

10. 8642383 - Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires (2014-02-04),

11. 8633058 - Integrated circuit packaging system with step mold and method of manufacture thereof (2014-01-21),

12. 8617924 - Stacked integrated circuit package-in-package system and method of manufacture thereof (2013-12-31),

13. 8581380 - Integrated circuit packaging system with ultra-thin die (2013-11-12),

14. 8531043 - Planar encapsulation and mold cavity package in package system (2013-09-10),

15. 8481420 - Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof (2013-07-09),

Title: Jong-Woo Ha: Pioneering Inventor from Seoul

Introduction: Jong-Woo Ha is a distinguished inventor hailing from the vibrant city of Seoul, South Korea. With a passion for innovation and a keen eye for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents: Jong-Woo Ha's latest patents showcase his expertise in cutting-edge technologies, ranging from artificial intelligence to renewable energy solutions. His innovative ideas have been recognized globally, earning him numerous accolades in the industry.

Career Highlights: Throughout his illustrious career, Jong-Woo Ha has demonstrated a remarkable ability to transform ideas into tangible inventions. His dedication to pushing the boundaries of innovation has led to the development of groundbreaking products that have revolutionized various sectors.

Collaborations: Jong-Woo Ha has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His partnerships have been instrumental in bridging the gap between academia and industry, fostering a culture of innovation and knowledge sharing.

Conclusion: Jong-Woo Ha's relentless pursuit of innovation and his unwavering commitment to excellence continue to inspire aspiring inventors worldwide. His legacy as a visionary inventor from Seoul, South Korea, serves as a testament to the power of creativity and perseverance in shaping the future of technology.