The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Aug. 22, 2008
Applicants:
Jong-woo Ha, Seoul, KR;
Daesik Choi, Seoul, KR;
Deokkyung Yang, Hanam-si, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 24/48 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/15331 (2013.01); H01L 2224/32145 (2013.01); H01L 23/3128 (2013.01); H01L 2224/73265 (2013.01); H01L 25/105 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1023 (2013.01); H01L 2224/48225 (2013.01);
Abstract
An integrated circuit package system includes providing a carrier having a first side and a second side; mounting an integrated circuit over the carrier with the first side facing the integrated circuit; attaching an external interconnect to the second side; and forming an encapsulation over the integrated circuit and around the external interconnect with the external interconnect exposed from the encapsulation and with the encapsulation and the second side forming a cavity.