IDiyas

For the Inventor, By the Inventor

Hanam-si, South Korea

DeokKyung Yang

USPTO Granted Patents = 46 

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 180(Granted Patents)


Location History:

  • Hanam-si, KR (2010 - 2018)
  • Seoul, KR (2020)
  • Incheon, KR (2018 - 2021)
  • Incheon Si, KR (2019 - 2023)

Company Filing History:

goldMedal46 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2023

Loading Chart...
46 patents (USPTO):Explore Patents
1. 11670618 - System-in-package with double-sided molding (2023-06-06),
2. 11652088 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2023-05-16),
3. 11587882 - Molded laser package with electromagnetic interference shield and method of making (2023-02-21),
4. 11367690 - Semiconductor device and method of forming an integrated SiP module with embedded inductor or package (2022-06-21),
5. 11342294 - Semiconductor device and method of forming protrusion e-bar for 3D SiP (2022-05-24),
6. 11244908 - Method and device for reducing metal burrs when sawing semiconductor packages (2022-02-08),
7. 11189598 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2021-11-30),
8. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),
9. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),
10. 10937741 - Molded laser package with electromagnetic interference shield and method of making (2021-03-02),
11. 10797039 - Semiconductor device and method of forming a 3D interposer system-in-package module (2020-10-06),
12. 10797024 - System-in-package with double-sided molding (2020-10-06),
13. 10790268 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-09-29),
14. 10700011 - Semiconductor device and method of forming an integrated SIP module with embedded inductor or package (2020-06-30),
15. 10636774 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-04-28),

Title: DeokKyung Yang: Pioneering Inventor from Hanam-si, KR

Introduction: DeokKyung Yang is a renowned inventor hailing from Hanam-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: DeokKyung Yang's latest patents include cutting-edge advancements in artificial intelligence, renewable energy technologies, and sustainable urban development solutions.

Career Highlights: With a career spanning over two decades, DeokKyung Yang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, DeokKyung Yang has collaborated with top scientists, engineers, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: DeokKyung Yang's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…