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For the Inventor, By the Inventor

Hanam-si, South Korea

DeokKyung Yang

USPTO Granted Patents = 46 

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 182(Granted Patents)


Location History:

  • Hanam-si, KR (2010 - 2018)
  • Seoul, KR (2020)
  • Incheon, KR (2018 - 2021)
  • Incheon Si, KR (2019 - 2023)

Company Filing History:

goldMedal46 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2023

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Areas of Expertise:
System-In-Package
Semiconductor Device
Integrated Circuit Packaging
Electromagnetic Interference Shield
3D Interposer
Embedded Die Substrate
Molded Laser Package
Conductive Pillars
Dual Side Mold
Cavity Package
Through Silicon Via
Package-On-Package
46 patents (USPTO):Explore Patents
1. 11670618 - System-in-package with double-sided molding (2023-06-06),
2. 11652088 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2023-05-16),
3. 11587882 - Molded laser package with electromagnetic interference shield and method of making (2023-02-21),
4. 11367690 - Semiconductor device and method of forming an integrated SiP module with embedded inductor or package (2022-06-21),
5. 11342294 - Semiconductor device and method of forming protrusion e-bar for 3D SiP (2022-05-24),
6. 11244908 - Method and device for reducing metal burrs when sawing semiconductor packages (2022-02-08),
7. 11189598 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2021-11-30),
8. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),
9. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),
10. 10937741 - Molded laser package with electromagnetic interference shield and method of making (2021-03-02),
11. 10797039 - Semiconductor device and method of forming a 3D interposer system-in-package module (2020-10-06),
12. 10797024 - System-in-package with double-sided molding (2020-10-06),
13. 10790268 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-09-29),
14. 10700011 - Semiconductor device and method of forming an integrated SIP module with embedded inductor or package (2020-06-30),
15. 10636774 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-04-28),

Title: DeokKyung Yang: Pioneering Inventor from Hanam-si, KR

Introduction: DeokKyung Yang is a renowned inventor hailing from Hanam-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: DeokKyung Yang's latest patents include cutting-edge advancements in artificial intelligence, renewable energy technologies, and sustainable urban development solutions.

Career Highlights: With a career spanning over two decades, DeokKyung Yang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, DeokKyung Yang has collaborated with top scientists, engineers, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: DeokKyung Yang's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.

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