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DeokKyung Yang

This inventor holds 46 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2023.

USPTO Granted Patents = 46 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 184(Granted Patents)

Location History:

Hanam-si, KR (2010 - 2018)
Seoul, KR (2020)
Incheon, KR (2018 - 2021)
Incheon Si, KR (2019 - 2023)

Company Filing History:

46 out of 1,842

Stats Chippac Pte. Ltd.

patents

Years Active: 2010-2023

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Areas of Expertise:

Integrated Circuit Packaging

System-in-Package

Semiconductor Device

3D Interposer

Embedded Die Substrate

Electromagnetic Interference Shield

Molded Laser Package

Thermal Management

Conductive Pillars

Dual Side Mold

Coreless Substrate

Protrusion E-Bar

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11670618 - System-in-package with double-sided molding (2023-06-06),

2. 11652088 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2023-05-16),

3. 11587882 - Molded laser package with electromagnetic interference shield and method of making (2023-02-21),

4. 11367690 - Semiconductor device and method of forming an integrated SiP module with embedded inductor or package (2022-06-21),

5. 11342294 - Semiconductor device and method of forming protrusion e-bar for 3D SiP (2022-05-24),

6. 11244908 - Method and device for reducing metal burrs when sawing semiconductor packages (2022-02-08),

7. 11189598 - Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same (2021-11-30),

8. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),

9. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),

10. 10937741 - Molded laser package with electromagnetic interference shield and method of making (2021-03-02),

11. 10797039 - Semiconductor device and method of forming a 3D interposer system-in-package module (2020-10-06),

12. 10797024 - System-in-package with double-sided molding (2020-10-06),

13. 10790268 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-09-29),

14. 10700011 - Semiconductor device and method of forming an integrated SIP module with embedded inductor or package (2020-06-30),

15. 10636774 - Semiconductor device and method of forming a 3D integrated system-in-package module (2020-04-28),

Title: DeokKyung Yang: Pioneering Inventor from Hanam-si, KR

Introduction: DeokKyung Yang is a renowned inventor hailing from Hanam-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: DeokKyung Yang's latest patents include cutting-edge advancements in artificial intelligence, renewable energy technologies, and sustainable urban development solutions.

Career Highlights: With a career spanning over two decades, DeokKyung Yang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, DeokKyung Yang has collaborated with top scientists, engineers, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: DeokKyung Yang's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.

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