The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
May. 10, 2018
Stats Chippac Pte. Ltd., Singapore, SG;
DeokKyung Yang, Incheon Si, KR;
OhHan Kim, In-cheon, KR;
HeeSoo Lee, Kyunggi-do, KR;
HunTeak Lee, Gyeongi-do, KR;
InSang Yoon, Seoul, KR;
Il Kwon Shim, Singapore, SG;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A semiconductor device has a first substrate and a second substrate. An opening is formed through the second substrate. A first semiconductor component and second semiconductor component are disposed between the first substrate and second substrate. The second substrate is electrically coupled to the first substrate through the first semiconductor component. A first terminal of the first semiconductor component is electrically coupled to the first substrate. A second terminal of the first semiconductor component is electrically coupled to the second substrate. The second semiconductor component extends into the opening. An encapsulant is deposited over the first substrate and second substrate.