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For the Inventor, By the Inventor

Seoul, South Korea

InSang Yoon

This inventor holds 11 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: InSang Yoon. Retrieved from https://idiyas.com/inventor/insang-yoon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 23(Granted Patents)


Company Filing History:

goldMedal11 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2019-2023

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11 patents (USPTO):Explore Patents
1. 11842991 - Semiconductor device and method of forming a 3D interposer system-in-package module (2023-12-12),
2. 11715703 - EMI shielding for flip chip package with exposed die backside (2023-08-01),
3. 11342278 - EMI shielding for flip chip package with exposed die backside (2022-05-24),
4. 11309193 - Semiconductor device and method of forming SIP module over film layer (2022-04-19),
5. 10804217 - EMI shielding for flip chip package with exposed die backside (2020-10-13),
6. 10804119 - Method of forming SIP module over film layer (2020-10-13),
7. 10797039 - Semiconductor device and method of forming a 3D interposer system-in-package module (2020-10-06),
8. 10629565 - Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant (2020-04-21),
9. 10418341 - Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant (2019-09-17),
10. 10388637 - Semiconductor device and method of forming a 3D interposer system-in-package module (2019-08-20),
11. 10319684 - Dummy conductive structures for EMI shielding (2019-06-11),

Title: InSang Yoon: Innovator in Semiconductor Technology

Introduction

InSang Yoon is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on advanced semiconductor devices and packaging techniques that enhance performance and efficiency.

Latest Patents

InSang Yoon's latest patents include innovative designs for semiconductor devices. One notable patent is for a semiconductor device and method of forming a 3D interposer system-in-package module. This invention features a first substrate and a second substrate, with an opening formed through the second substrate. It allows for the integration of a first semiconductor component and a second semiconductor component, enhancing the electrical coupling between the substrates. Another significant patent is for EMI shielding for flip chip packages with exposed die backsides. This design includes a substrate and a semiconductor die, with an encapsulant deposited over the die and substrate, ensuring effective shielding and thermal management.

Career Highlights

InSang Yoon is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His expertise in the field has led to numerous advancements that benefit the industry.

Collaborations

In his career, InSang Yoon has collaborated with notable colleagues, including OhHan Kim and Il Kwon Shim. These partnerships have fostered innovation and contributed to the development of cutting-edge semiconductor solutions.

Conclusion

InSang Yoon is a distinguished inventor whose work in semiconductor technology has made a lasting impact. His patents reflect a commitment to innovation and excellence in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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