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For the Inventor, By the Inventor

Gyeongi-do, South Korea

HunTeak Lee

USPTO Granted Patents = 45 

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 79(Granted Patents)


Location History:

  • Kyongki-do, KR (2011)
  • Kyungki-Do, KR (2013)
  • Kyoungki-do, KR (2011 - 2016)
  • Gyeonggi-do, KR (2015 - 2017)
  • Gyeongi-dov, KR (2022)
  • Gyeongi-do, KR (2019 - 2024)

Company Filing History:

goldMedal45 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2025

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Areas of Expertise:
Cooling Devices
Semiconductor Manufacturing
System-In-Package
Electromagnetic Interference Shielding
Antenna Modules
3D Interposer
Die Bonding
Thermal Compression Bonding
Molded Laser Packages
Flip Chip Packages
Metal Burr Reduction
45 patents (USPTO):Explore Patents
1. 12385128 - Cooling device and process for cooling double-sided SiP devices during sputtering (2025-08-12),
2. 12374559 - Double-sided partial molded SiP module (2025-07-29),
3. 12304122 - Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulant (2025-05-20),
4. 12266614 - Molded laser package with electromagnetic interference shield and method of making (2025-04-01),
5. 12211808 - Semiconductor device and method of forming discrete antenna modules (2025-01-28),
6. 12211803 - Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation (2025-01-28),
7. 12136759 - Antenna-in-package devices and methods of making (2024-11-05),
8. 12046564 - Method and device for reducing metal burrs when sawing semiconductor packages (2024-07-23),
9. 11990424 - Selective EMI shielding using preformed mask (2024-05-21),
10. 11935777 - Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support (2024-03-19),
11. 11932933 - Cooling device and process for cooling double-sided SiP devices during sputtering (2024-03-19),
12. 11894314 - Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation (2024-02-06),
13. 11887863 - Double-sided partial molded SIP module (2024-01-30),
14. 11842991 - Semiconductor device and method of forming a 3D interposer system-in-package module (2023-12-12),
15. 11735539 - Semiconductor device and method of forming discrete antenna modules (2023-08-22),

Title: HunTeak Lee - Innovative Inventor from Gyeongi-do, South Korea

Introduction: HunTeak Lee is a renowned inventor hailing from Gyeongi-do, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Lee's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, HunTeak Lee has established himself as a pioneer in the tech industry, with numerous patents and inventions that have revolutionized the way we harness and utilize energy.

Collaborations: Throughout his career, Lee has collaborated with leading research institutions and tech companies to further his innovative projects, showcasing his ability to work across disciplines and industries to drive progress.

Conclusion: In conclusion, HunTeak Lee's dedication to innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor in the global tech community.

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