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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12136759 B1

PDFFull Text
Date of Patent:
Nov. 05, 2024

Filed:

Oct. 29, 2021

Antenna-in-package devices and methods of making

Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

HunTeak Lee, Gyeonggi-do, KR;

KyoungHee Park, Seoul, KR;

KyungHwan Kim, Seoul, KR;

SeungHyun Lee, Incheon, KR;

SangJun Park, Incheon, KR;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:

Brian M. Kaufman

Robert D. Atkins

PATENT LAW GROUP: Atkins and Associates, P.C.

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/552 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H01L 23/49816 (2013.01); H01L 25/16 (2013.01); H01R 12/716 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.

Find Patent Forward Citations

Lee, HunTeak. (2024). Antenna-in-package devices and methods of making (U.S. Patent No. 12136759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12136759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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