Incheon, South Korea

Seunghyun Lee

This inventor holds 19 USPTO granted patents and 53 published patent applications, primarily in Semiconductor Packaging. Top assignees: Jcet Stats Chippac Korea Limited, Stats Chippac Pte. Ltd., Hyundai Motor Company. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seunghyun Lee. Retrieved from https://idiyas.com/inventor/seunghyun-lee-2oar4fds

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 36.8

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017-2026

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Areas of Expertise:
Semiconductor Device
Antenna-In-Package
EMI Shielding
Thermal Dissipation
3D Stacked Package
Electronic Package
Signal Interference
Light Sintering
Graphene-Coated Cores
Wafer-Level Package
Compartment Shielding
19 patents (USPTO):Explore Patents

Title: The Innovative Journey of Seunghyun Lee

Introduction

Seunghyun Lee, an accomplished inventor based in Incheon, South Korea, has made significant contributions to the field of semiconductor technologies. With a total of four patents to his name, his inventions reflect a deep understanding of advanced thermal dissipation methods and integrated device structures.

Latest Patents

Among his latest innovations, the patent for a semiconductor device and method for advanced thermal dissipation stands out. This invention introduces a semiconductor device featuring a substrate and a semiconductor die, with a specialized tape and encapsulant that work together to enhance thermal management. The inclusion of a shielding layer and a heat spreader, designed with a protrusion extending into the encapsulant's cavity, significantly improves the device's efficiency in heat dispersion.

Additionally, Lee has developed an integrated antenna-in-package structure, which includes a first substrate with an electrical component and a board-to-board connector. The encapsulant forms a subpackage that ensures the connector remains accessible, allowing for seamless integration with antennas through a contact pad. This innovative approach showcases Lee's commitment to enhancing the functionality of electronic devices.

Career Highlights

Throughout his career, Seunghyun Lee has worked with notable companies such as Stats Chippac Pte. Ltd. and Hyundai Motor Company. His experiences at these prominent organizations have provided him with unique insights and opportunities to drive innovation in semiconductor solutions.

Collaborations

Lee has collaborated with talented professionals in the industry, including HeeSoo Lee and Jungwu Jung. These partnerships have enabled the exchange of ideas and expertise, ultimately leading to the successful development of groundbreaking technologies.

Conclusion

Seunghyun Lee exemplifies the spirit of innovation, demonstrated through his patents and contributions to the semiconductor industry. His continuous pursuit of advanced solutions highlights the importance of collaboration and creativity in driving technological progress. As the field evolves, Lee's inventions will likely play a significant role in shaping the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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