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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12660673 B1

PDFFull Text
Date of Patent:
Jun. 16, 2026

Filed:

Mar. 24, 2023

Semiconductor device and method of forming an antenna-in-package structure

Applicant:

Jcet Stats Chippac Korea Limited, Incheon, KR;

Inventors:

Yejin Park, Incheon, KR;

Seunghyun Lee, Incheon, KR;

Heesoo Lee, Incheon, KR;

Assignee:

JCET STATS ChipPAC Korea Limited, , KR;

Attorneys:

Brian M. Kaufman

Robert D. Atkins

PATENT LAW GROUP: Atkins and Associates, P.C.

Primary Examiner:

Kretelia Graham

Assistant Examiner:

Hamna Fathima Iqbal

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H10W 44/20 (2026.01); H10W 70/63 (2026.01); H10W 72/20 (2026.01); H10W 74/10 (2026.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H10W 74/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/121 (2026.01); H10W 44/20 (2026.01); H10W 70/635 (2026.01); H10W 72/20 (2026.01); H10W 74/117 (2026.01); H10W 74/127 (2026.01); H10W 44/209 (2026.01); H10W 74/00 (2026.01); H10W 90/734 (2026.01);
Abstract

A semiconductor device has a substrate including an antenna formed in a first area of the substrate. An electrical component is disposed over a second area of the substrate. An interconnect structure is disposed over a third area of the substrate. A first encapsulant is deposited over the electrical component and interconnect structure. A second encapsulant is disposed over the antenna. The second encapsulant includes a higher dielectric constant than the first encapsulant.

Find Patent Forward Citations

Park, Yejin. (2026). Semiconductor device and method of forming an antenna-in-package structure (U.S. Patent No. 12660673). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660673

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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