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10 inventors (with patents filed for the assignee):

Seunghyun Lee (3 out of 6 patents)

Heesoo Lee (2 out of 2 patents)

HeeSoo Lee (1 out of 38 patents)

4. Yongju Lee (1 out of 18 patents)

5. Jinhyeok Song (1 out of 3 patents)

6. JiWon Seong (1 out of 1 patent)

7. SeongHyun Kang (1 out of 1 patent)

8. YeJin Park (1 out of 1 patent)

9. YoungEun Seo (1 out of 1 patent)

10. DeokWoo Nam (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 12444718 - Semiconductor device and method of forming compartment shielding for a semiconductor package (2025-10-14),

2. 12431437 - Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation (2025-09-30),

3. 12379413 - Semiconductor test equipment and method of performing current and voltage test measurements (2025-08-05),

4. 12211773 - Integrated antenna-in-package structure (2025-01-28),

5. 12092676 - Semiconductor device and method for improved antenna testing (2024-09-17),

Jcet Stats Chippac Korea Limited is a leading provider of semiconductor packaging and testing services. The company specializes in advanced packaging solutions, including flip chip, wafer-level packaging, and system-in-package technologies. With a strong focus on innovation and quality, Jcet Stats Chippac Korea serves a diverse range of industries, including consumer electronics, automotive, and telecommunications. The company is committed to delivering high-performance solutions that meet the evolving needs of its global customers, leveraging state-of-the-art facilities and a skilled workforce to ensure excellence in every project.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

5 Patents

#70 in Incheon

#1,791 in South Korea

Incheon, South Korea

Jcet Stats Chippac Korea Limited