The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Sep. 15, 2022
Applicant:
Jcet Stats Chippac Korea Limited, Incheon, KR;
Inventors:
SeungHyun Lee, Incheon, KR;
HeeSoo Lee, Incheon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/58 (2006.01); H01L 25/16 (2023.01); H01Q 9/04 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01L 23/49805 (2013.01); H01L 23/552 (2013.01); H01L 23/58 (2013.01); H01L 25/16 (2013.01); H01Q 9/0485 (2013.01); H01R 12/716 (2013.01);
Abstract
A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.