The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Mar. 22, 2023
Applicant:
Jcet Stats Chippac Korea Limited, Incheon, KR;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H10D 1/47 (2025.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H10D 1/47 (2025.01); H01L 2224/08112 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/182 (2013.01);
Abstract
A semiconductor device has a substrate. A first electrical component and second electrical component are disposed over the substrate. A zero-ohm resistor is disposed over the substrate between the first electrical component and second electrical component. An encapsulant is deposited over the substrate, first electrical component, second electrical component, and first zero-ohm resistor. An opening is formed through the encapsulant to the first zero-ohm resistor. A shielding layer is formed over the encapsulant and into the opening.