The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Mar. 23, 2023
Applicant:
Jcet Stats Chippac Korea Limited, Incheon, KR;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H10W 42/20 (2026.01); H10W 44/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 72/29 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 42/20 (2026.01); H10W 74/016 (2026.01); H10W 74/117 (2026.01); H10W 44/248 (2026.01); H10W 72/29 (2026.01); H10W 72/9413 (2026.01); H10W 72/952 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor device has a substrate and a first electrical component disposed over the substrate. An encapsulant is deposited over the first electrical component. A shielding layer is formed over the encapsulant. The shielding layer is patterned to form a conductive trace and a contact pad. A board-to-board (B2B) connector is disposed over the encapsulant and electrically coupled to the substrate by the conductive trace.
Lee, Seunghyun. (2026). Semiconductor device and method of forming a 3-d stacked semiconductor package structure (U.S. Patent No. 12604739). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604739
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile