Company Filing History:
Years Active: 2025
Title: YongMoo Shin: Innovator in Semiconductor Technology
Introduction
YongMoo Shin is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to electrical components and interconnects.
Latest Patents
His latest patents include a semiconductor device and method of forming RDL with a graphene-coated core. This invention features a one-layer interconnect substrate with electrical components disposed over its surface. The RDL, which incorporates a graphene core shell, enhances electrical conductivity and interconnectivity within a system-in-package (SIP). Another notable patent is the semiconductor device and method of forming a graphene-coated core embedded within a thermal interface material (TIM). This invention allows for efficient thermal management by utilizing a core covered with graphene, ensuring effective heat dissipation from the electrical components.
Career Highlights
YongMoo Shin is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge semiconductor technologies. His work has significantly impacted the efficiency and performance of electronic devices.
Collaborations
He collaborates with talented coworkers, including Hyunseok Park and HeeSoo Lee, to drive innovation in their projects.
Conclusion
YongMoo Shin's contributions to semiconductor technology through his patents reflect his dedication to advancing the field. His innovative solutions are paving the way for more efficient electronic devices in the future.