YongMoo Shin

This inventor holds 13 USPTO granted patents and 12 published patent applications. Top assignees: Stats Chippac Pte. Ltd., Jcet Stats Chippac Korea Limited. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: YongMoo Shin. Retrieved from https://idiyas.com/inventor/yongmoo-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 (Patent Applications = 12)

% Patents Active = 23.1

Average Co-Inventor Count = 3.1

ph-index = 1

Company Filing History:

11 out of 1,843

Stats Chippac Pte. Ltd.

patents

2 out of 10

Jcet Stats Chippac Korea Limited

patents

Years Active: 2025-2026

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740469 - Semiconductor device and method of forming an antenna-in-package structure (2026-09-15),

2. 12713951 - Semiconductor Device and Method of Making Redistribution Layers with Intensive Pulsed Light Irradiation (2026-08-18),

3. 12713932 - Semiconductor Device and Method of Forming EMI Shielding Material in Two-Step Process Using Light Sintering (2026-08-18),

4. 12708038 - Semiconductor device and method of die attach with adhesive layer containing graphene-coated core (2026-08-11),

5. 12690316 - Method of making a semiconductor package with graphene for die attach (2026-07-21),

6. 12635526 - Semiconductor device and method of making an EMI shield using intensive pulsed light irradiation (2026-05-19),

7. 12622277 - Semiconductor device and method of partial shielding with embedded graphene core shells (2026-05-05),

8. 12610851 - Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects (2026-04-21),

9. 12588572 - Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores (2026-03-24),

10. 12581974 - Semiconductor device and method of making a semiconductor package with graphene-coated interconnects (2026-03-17),

11. 12564059 - Semiconductor device and method of forming graphene core shell embedded within shielding layer (2026-02-24),

12. 12431422 - Semiconductor device and method of forming RDL with graphene-coated core (2025-09-30),

13. 12400929 - Semiconductor device and method of forming graphene-coated core embedded within TIM (2025-08-26),

Title: YongMoo Shin: Innovator in Semiconductor Technology

Introduction

YongMoo Shin is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding 13 patents that showcase his innovative approach to electrical components and interconnects.

Latest Patents

His latest patents include a semiconductor device and method of forming RDL with a graphene-coated core. This invention features a one-layer interconnect substrate with electrical components disposed over its surface. The RDL, which incorporates a graphene core shell, enhances electrical conductivity and interconnectivity within a system-in-package (SIP). Another notable patent is the semiconductor device and method of forming a graphene-coated core embedded within a thermal interface material (TIM). This invention allows for efficient thermal management by utilizing a core covered with graphene, ensuring effective heat dissipation from the electrical components.

Career Highlights

YongMoo Shin is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge semiconductor technologies. His work has significantly impacted the efficiency and performance of electronic devices.

Collaborations

He collaborates with talented coworkers, including Hyunseok Park and HeeSoo Lee, to drive innovation in their projects.

Conclusion

YongMoo Shin's contributions to semiconductor technology through his patents reflect his dedication to advancing the field. His innovative solutions are paving the way for more efficient electronic devices in the future.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

12 patents pending: