The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jul. 24, 2023
Jcet Stats Chippac Korea Limited, Incheon, KR;
Abstract
A semiconductor device has a substrate including an antenna formed in a first area of the substrate. A first electrical component is disposed over a second area of the substrate. A conductive pillar is disposed on the substrate adjacent to the first electrical component. A second electrical component is disposed on the conductive pillar and over the first electrical component. An interconnect structure is disposed over a third area of the substrate. A first encapsulant is deposited over the first electrical component and interconnect structure. A second encapsulant is deposited over the second electrical component. A third encapsulant is disposed over the antenna. The third encapsulant includes a higher dielectric constant than the first encapsulant and second encapsulant.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile