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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12765405 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Sep. 27, 2023

Method for forming a shielding layer on a semiconductor device

Applicant:

Jcet Stats Chippac Korea Limited, Incheon, KR;

Inventors:

Seunghyun Lee, Incheon, KR;

Huntaek Lee, Gyeonggi-do, KR;

Kyounghee Park, Seoul, KR;

Seonghwan Park, Incheon, KR;

Younghoon Jeon, Incheon, KR;

Heesoo Lee, Incheon, KR;

Assignee:
Attorneys:

Junhe Law Office P.C.

Yi Zhang

Primary Examiner:

Tong-Ho Kim

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H10W 42/20 (2026.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 42/20 (2026.01); H10W 70/05 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
Abstract

A method for forming a shielding layer on a semiconductor device is disclosed. The semiconductor device comprises a bond pad formed on a front side of a substrate and extends a first lateral surface of the substrate. The method comprises: etching a portion of the bond pad adjacent to the first lateral surface, to form a gap between the bond pad and the first lateral surface; attaching a filler onto the bond pad to fill the gap; and applying a shielding layer to a back side of the substrate.

Find Patent Forward Citations

Lee, Seunghyun. (2026). Method for forming a shielding layer on a semiconductor device (U.S. Patent No. 12765405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765405

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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