The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Aug. 30, 2023
Jcet Stats Chippac Korea Limited, Incheon, KR;
Hyodong Ryu, Incheon, KR;
Seunghyun Lee, Incheon, KR;
Wonsang Rhee, Incheon, KR;
Huntaek Lee, Gyeonggi-do, KR;
Kyounghee Park, Seoul, KR;
Abstract
Provided is an electronic component, comprising: a substrate; a first set of conductive pads on the substrate and at which a set of terminals of a first electronic component are to be mounted, respectively; and solder paste formed on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads.