The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
May. 21, 2020
Stats Chippac Pte. Ltd., Singapore, SG;
DeokKyung Yang, Incheon Si, KR;
Woonjae Beak, Incheon, KR;
YiSu Park, Incheon Si, KR;
OhHan Kim, In-cheon, KR;
HunTeak Lee, Gyeongi-dov, KR;
HeeSoo Lee, Kyunggi-do, KR;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A semiconductor device has a substrate with a first opening and second opening formed in the substrate. A first semiconductor component is disposed on the substrate. The substrate is disposed on a carrier. A second semiconductor component is disposed on the carrier in the first opening of the substrate. A third semiconductor component is disposed in the second opening. The third semiconductor component is a semiconductor package in some embodiments. A first shielding layer may be formed over the semiconductor package. An encapsulant is deposited over the substrate, first semiconductor component, and second semiconductor component. A shielding layer may be formed over the encapsulant.