The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Jun. 11, 2018
Stats Chippac Pte. Ltd., Singapore, SG;
Byung Joon Han, Singapore, SG;
Il Kwon Shim, Singapore, SG;
KyoungHee Park, Seoul, KR;
Yaojian Lin, Singapore, SG;
KyoWang Koo, Incheon-si, KR;
In Sang Yoon, Seoul, KR;
SeungYong Chai, Incheon, KR;
SungWon Cho, Seoul, KR;
SungSoo Kim, Seoul, KR;
Hun Teak Lee, Seongnam-si, KR;
DeokKyung Yang, Incheon, KR;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.