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For the Inventor, By the Inventor

Singapore, Singapore

Byung Joon Han

This inventor holds 63 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Stats Chippac Pte. Ltd., St Assembly Test Services Inc., Amkor Technology, Inc.. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Joon Han. Retrieved from https://idiyas.com/inventor/byung-joon-han

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 63 

% Patents Active = 98.4

Average Co-Inventor Count = 3.5

ph-index = 17

Forward Citations = 982(Granted Patents)

Forward Citations (Not Self Cited) = 935(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Seoul, KR (2002)
  • Singapore, KR (2009)
  • Singapore, SG (2002 - 2022)

Company Filing History:

goldMedal48 out of 1,843 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal10 out of 103 
 
St Assembly Test Services Inc.
 patents
bronzeMedal4 out of 1,009 
 
Amkor Technology, Inc.
 patents
4. 1 out of 834,453 
Other
 patents

Years Active: 2002-2026

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Areas of Expertise:
Integrated Circuit
Semiconductor Device
Chip Scale Packages
Electromagnetic Shielding
Wafer Level Packaging
Active Region
Interconnects
Bonding Structure
Flexible Substrate
Stacking System
Molded Cavity
Carrier Fabrication
63 patents (USPTO):Explore Patents
1. 12727502 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2026-09-01),
2. 12469819 - Semiconductor device and method of forming embedded wafer level chip scale packages (2025-11-11),
3. 11488933 - Semiconductor device and method of forming embedded wafer level chip scale packages (2022-11-01),
4. 11488932 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2022-11-01),
5. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),
6. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),
7. 10777528 - Semiconductor device and method of forming embedded wafer level chip scale packages (2020-09-15),
8. 10658330 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2020-05-19),
9. 10388612 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2019-08-20),
10. 10217873 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus (2019-02-26),
11. 9997468 - Integrated circuit packaging system with shielding and method of manufacturing thereof (2018-06-12),
12. 9934998 - Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy (2018-04-03),
13. 9754897 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2017-09-05),
14. 9721862 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2017-08-01),
15. 9704824 - Semiconductor device and method of forming embedded wafer level chip scale packages (2017-07-11),

Title: Inventor Byung Joon Han - Revolutionizing Technology in Singapore

Introduction: Byung Joon Han is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Byung Joon Han holds several patents in the areas of artificial intelligence, renewable energy, and sustainable urban development, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Byung Joon Han has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Byung Joon Han has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: Byung Joon Han's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Singapore and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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