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For the Inventor, By the Inventor

Singapore, Singapore

Byung Joon Han

USPTO Granted Patents = 62 

Average Co-Inventor Count = 3.5

ph-index = 17

Forward Citations = 965(Granted Patents)

Forward Citations (Not Self Cited) = 934(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Seoul, KR (2002)
  • Singapore, KR (2009)
  • Singapore, SG (2002 - 2022)

Company Filing History:

goldMedal47 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal10 out of 103 
 
St Assembly Test Services Inc.
 patents
bronzeMedal4 out of 1,009 
 
Amkor Technology, Inc.
 patents
4. 1 out of 832,680 
Other
 patents

Years Active: 2002-2025

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62 patents (USPTO):
1. 12469819 - Semiconductor device and method of forming embedded wafer level chip scale packages (2025-11-11),
2. 11488933 - Semiconductor device and method of forming embedded wafer level chip scale packages (2022-11-01),
3. 11488932 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2022-11-01),
4. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),
5. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),
6. 10777528 - Semiconductor device and method of forming embedded wafer level chip scale packages (2020-09-15),
7. 10658330 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2020-05-19),
8. 10388612 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2019-08-20),
9. 10217873 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus (2019-02-26),
10. 9997468 - Integrated circuit packaging system with shielding and method of manufacturing thereof (2018-06-12),
11. 9934998 - Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy (2018-04-03),
12. 9754897 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2017-09-05),
13. 9721862 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2017-08-01),
14. 9704824 - Semiconductor device and method of forming embedded wafer level chip scale packages (2017-07-11),
15. 9564413 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus (2017-02-07),

Title: Inventor Byung Joon Han - Revolutionizing Technology in Singapore

Introduction: Byung Joon Han is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Byung Joon Han holds several patents in the areas of artificial intelligence, renewable energy, and sustainable urban development, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Byung Joon Han has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Byung Joon Han has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: Byung Joon Han's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Singapore and beyond.

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