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Singapore, Singapore

Byung Joon Han

USPTO Granted Patents = 62 (Patent Applications = 3)

Average Co-Inventor Count = 3.5

ph-index = 17

Forward Citations = 966(Granted Patents)

Forward Citations (Not Self Cited) = 935(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Seoul, KR (2002)
Singapore, KR (2009)
Singapore, SG (2002 - 2022)

Company Filing History:

47 out of 1,812

Stats Chippac Pte. Ltd.

St Assembly Test Services Inc.

Amkor Technology, Inc.

4. 1 out of 832,891

Other

patents

Years Active: 2002-2025

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Areas of Expertise:

Semiconductor Devices

Integrated Circuit Packaging

Electromagnetic Shielding

Wafer Level Chip Scale Packages

Chip Carrier Fabrication

3-D Package Stacking

Thin Semiconductor Wafer Singulation

Active Region Semiconductor Die

Encapsulant Cavity Packages

Vertical Interconnects

Package-on-Package Systems

Wire Bonding Structures

62 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469819 - Semiconductor device and method of forming embedded wafer level chip scale packages (2025-11-11),

2. 11488933 - Semiconductor device and method of forming embedded wafer level chip scale packages (2022-11-01),

3. 11488932 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2022-11-01),

4. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),

5. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),

6. 10777528 - Semiconductor device and method of forming embedded wafer level chip scale packages (2020-09-15),

7. 10658330 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2020-05-19),

8. 10388612 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2019-08-20),

9. 10217873 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus (2019-02-26),

10. 9997468 - Integrated circuit packaging system with shielding and method of manufacturing thereof (2018-06-12),

11. 9934998 - Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy (2018-04-03),

12. 9754897 - Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits (2017-09-05),

13. 9721862 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2017-08-01),

14. 9704824 - Semiconductor device and method of forming embedded wafer level chip scale packages (2017-07-11),

15. 9564413 - Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus (2017-02-07),

Title: Inventor Byung Joon Han - Revolutionizing Technology in Singapore

Introduction: Byung Joon Han is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Byung Joon Han holds several patents in the areas of artificial intelligence, renewable energy, and sustainable urban development, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Byung Joon Han has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Byung Joon Han has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: Byung Joon Han's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Singapore and beyond.

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