In Sang Yoon

This inventor holds 30 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: In Sang Yoon. Retrieved from https://idiyas.com/inventor/in-sang-yoon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 158(Granted Patents)

Location History:

Ichon-si, KR (2010 - 2017)
Seoul, KR (2015 - 2021)

Company Filing History:

30 out of 1,845

Stats Chippac Pte. Ltd.

patents

Years Active: 2010-2021

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Areas of Expertise:

Integrated Circuit

Packaging System

Interposer

Shielding

Stacking

Conductive Pillars

Vertical Interconnects

Molded Laser Via

Semiconductor

Coreless

Multichip Package

Bump Chip Carrier

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11145603 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-10-12),

2. 11024585 - Integrated circuit packaging system with shielding and method of manufacture thereof (2021-06-01),

3. 10083903 - Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof (2018-09-25),

4. 9997468 - Integrated circuit packaging system with shielding and method of manufacturing thereof (2018-06-12),

5. 9905491 - Interposer substrate designs for semiconductor packages (2018-02-27),

6. 9748203 - Integrated circuit packaging system with conductive pillars and method of manufacture thereof (2017-08-29),

7. 9385066 - Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof (2016-07-05),

8. 9349666 - Integrated circuit packaging system with package stacking (2016-05-24),

9. 9202715 - Integrated circuit packaging system with connection structure and method of manufacture thereof (2015-12-01),

10. 9142530 - Coreless integrated circuit packaging system and method of manufacture thereof (2015-09-22),

11. 8765525 - Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer (2014-07-01),

12. 8698297 - Integrated circuit packaging system with stack device (2014-04-15),

13. 8674516 - Integrated circuit packaging system with vertical interconnects and method of manufacture thereof (2014-03-18),

14. 8633100 - Method of manufacturing integrated circuit packaging system with support structure (2014-01-21),

15. 8558366 - Integrated circuit packaging system with interposer interconnections and method of manufacture thereof (2013-10-15),

Title: In Sang Yoon: Innovator in Integrated Circuit Packaging

Introduction: In Sang Yoon is a prolific inventor based in Ichon-si, South Korea, renowned for his significant contributions to the field of integrated circuit packaging. With a remarkable portfolio of 30 patents, Yoon is recognized for his innovative approaches that enhance the efficiency and functionality of electronic components.

Latest Patents: Among his latest inventions is a groundbreaking patent for an integrated circuit packaging system with shielding and method of manufacture thereof. This integrated circuit packaging system integrates a substrate with internal circuitry that connects the substrate's top side, bottom side, and vertical sides. The system includes an integrated circuit coupled to this internal circuitry, a molded package body formed directly on both the integrated circuit and the substrate's top side, and a conductive conformal shield structure that extends below the substrate's bottom side. This innovative design aims to improve performance by effectively shielding the integrated circuit from external interferences.

Career Highlights: In Sang Yoon is currently employed at Stats Chippac Pte. Ltd., where he continues to advance technological boundaries through his inventive work. His impressive body of work demonstrates not only his technical expertise but also his commitment to the advancement of integrated circuit technology.

Collaborations: Throughout his career, Yoon has collaborated with talented professionals like DeokKyung Yang and JoHyun Bae. These partnerships have played a crucial role in his innovative processes and have contributed to the successful realization of many of his groundbreaking projects.

Conclusion: In Sang Yoon stands out as an influential figure in the field of integrated circuits, demonstrating the power of innovation through his extensive patent portfolio. His work at Stats Chippac Pte. Ltd. and collaborations with fellow inventors showcase the dynamic environment of technological advancement and the continued relevance of patenting as a means to protect and promote invention.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]