The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Nov. 16, 2011
Youngchul Kim, Youngin-si, KR;
Kyunghoon Lee, Icheon, KR;
Seong Won Park, Icheon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Jaehyun Lee, Sungnam, KR;
Deokkyung Yang, Hanam-si, KR;
IN Sang Yoon, Ichon-si, KR;
Sungeun Park, Seoul, KR;
YoungChul Kim, Youngin-si, KR;
KyungHoon Lee, Icheon, KR;
Seong Won Park, Icheon-si, KR;
Ki Youn Jang, Ichon-si, KR;
JaeHyun Lee, Sungnam, KR;
DeokKyung Yang, Hanam-si, KR;
In Sang Yoon, Ichon-si, KR;
SungEun Park, Seoul, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.