logo

For the Inventor, By the Inventor

Kyungki-Do, South Korea

YoungChul Kim

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignees: Stats Chippac Pte. Ltd., Hyundai Motor Company, Samsung Electronics Co., Ltd.. Active years: 2010-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: YoungChul Kim. Retrieved from https://idiyas.com/inventor/youngchul-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 90.0

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 90(Granted Patents)


Location History:

  • Yongin-si, KR (2011 - 2014)
  • Kyonggi-do, KR (2010 - 2016)
  • Youngin-si, KR (2014 - 2016)
  • Kyoungki-di, KR (2016)
  • Kyoungki-do, KR (2016 - 2017)
  • Gyeonggi-Do, KR (2012 - 2022)

Company Filing History:

goldMedal17 out of 1,846 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal2 out of 20,399 
 
Hyundai Motor Company
 patents
bronzeMedal1 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2010-2022

Loading Chart...
Areas of Expertise:
Semiconductor Device
Thermal Compression Bonding
Integrated Circuit Packaging
Fan-In Package
Flip Chip
Through Silicon Vias
Surface Treatment
Bumpless Flipchip
Cooling System
Hybrid Vehicle
Stackable Package
Connection Structure
20 patents (USPTO):Explore Patents
1. 11506558 - Apparatus and method for inspecting ventilation (2022-11-22),
2. 9721921 - Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form (2017-08-01),
3. 9559046 - Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias (2017-01-31),
4. 9524958 - Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding (2016-12-20),
5. 9385100 - Integrated circuit packaging system with surface treatment and method of manufacture thereof (2016-07-05),
6. 9287204 - Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form (2016-03-15),
7. 9252130 - Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding (2016-02-02),
8. 9245772 - Stackable package by using internal stacking modules (2016-01-26),
9. 9245770 - Semiconductor device and method of simultaneous molding and thermalcompression bonding (2016-01-26),
10. 9240331 - Semiconductor device and method of making bumpless flipchip interconnect structures (2016-01-19),
11. 9202715 - Integrated circuit packaging system with connection structure and method of manufacture thereof (2015-12-01),
12. 9093415 - Integrated circuit packaging system with heat spreader and method of manufacture thereof (2015-07-28),
13. 8906740 - Integrated circuit packaging system having dual sided connection and method of manufacture thereof (2014-12-09),
14. 8816487 - Integrated circuit packaging system with package-in-package and method of manufacture thereof (2014-08-26),
15. 8774996 - Cooling system for cooling driving motor of hybrid vehicle and method for controlling the same (2014-07-08),

Title: **YoungChul Kim: Innovator in Semiconductor Technology and Ventilation Inspection**

Introduction

YoungChul Kim, located in Kyoungki-do, South Korea, is a distinguished inventor with an impressive portfolio of 20 patents. His contributions primarily lie in the fields of semiconductor technology and innovative inspection methods, showcasing his commitment to advancing technology and improving industrial processes.

Latest Patents

Among YoungChul Kim's most recent inventions is an "Apparatus and Method for Inspecting Ventilation." This innovative device includes a seating unit designed for attaching an object to be inspected, featuring a unique through-hole structure. Additionally, it includes a measuring unit with a fluid supply passage that directs fluid toward the inspected object and a compressing unit that applies pressure while allowing for controlled fluid discharge, facilitating accurate inspection results.

Another significant patent is for a "Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form." This technology involves placing multiple semiconductor die on a carrier, linking them through electrical interconnects like stud bumps. The process enhances efficiency by allowing bonding while maintaining the semiconductor die in reconstituted wafer form, ensuring high throughput for flip-chip interconnections.

Career Highlights

YoungChul Kim has held positions at leading companies, including Stats Chippac Pte. Ltd. and Hyundai Motor Company. His role in these organizations reflects his expertise and commitment to innovation in the semiconductor and automotive industries, making substantial impacts through his innovative projects and technological advancements.

Collaborations

Throughout his career, YoungChul has worked alongside notable professionals such as HeeJo Chi and KyungMoon Kim. These collaborations have contributed to the success of his projects, fostering an exchange of ideas and enhancing the overall quality of their innovations.

Conclusion

YoungChul Kim stands out as a remarkable inventor whose work continues to influence the fields of semiconductor technology and ventilation systems. With multiple patents to his name, his ongoing contributions are sure to create further advancements in these areas. As the industry evolves, innovators like YoungChul Kim will undoubtedly pave the way for future breakthroughs and enhance technological capabilities across various sectors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…