The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Mar. 29, 2013
Stats Chippac, Ltd., Singapore, SG;
KyungMoon Kim, Gyeonggi-do, KR;
YoungChul Kim, Kyoungki-do, KR;
HunTeak Lee, Gyeonggi-do, KR;
KeonTaek Kang, Kyoungki-do, KR;
HeeJo Chi, Kyoungki-do, KR;
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
Methods of producing a semiconductor package using dual-sided thermal compression bonding includes providing a substrate having an upper surface and a lower surface. A first device having a first surface and a second surface can be provided along with a second device having a third surface and a fourth surface. The first surface of the first device can be coupled to the upper surface of the substrate while the third surface of the second device can be coupled to the lower surface of the substrate, the coupling occurring simultaneously to produce the semiconductor package.