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Kyoungki-do, South Korea

HeeJo Chi

USPTO Granted Patents = 85 (Patent Applications = 12)

Average Co-Inventor Count = 3.4

ph-index = 18

Forward Citations = 1,094(Granted Patents)

Forward Citations (Not Self Cited) = 1,070(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Ichon si, KR (2011 - 2016)
Daejeon-si, KR (2011 - 2017)
Kyonggi-Do, KR (2017)
Yeoju-gun, KR (2014 - 2018)
Kyoungki-do, KR (2012 - 2023)

Company Filing History:

83 out of 1,812

Stats Chippac Pte. Ltd.

Stats Chippac Ptc. Ltd.

Jcet Semiconductor (shaoxing) Co., Ltd.

Years Active: 2011-2023

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Areas of Expertise:

Semiconductor Device

Integrated Circuit Packaging

3D Dual Side Die

Vertical Interconnect

Face-to-Face WLCSP

Embedded Wafer Level Ball Grid Array

Thermal Compression Bonding

Conductive Layer Formation

Interposer Frame

Leadframe Technology

Redistribution Layer

Photoimagable Dielectric

85 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11688612 - Semiconductor device and method of forming interposer with opening to contain semiconductor die (2023-06-27),

2. 10903183 - Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die (2021-01-26),

3. 10573600 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2020-02-25),

4. 10510703 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2019-12-17),

5. 9966335 - Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die (2018-05-08),

6. 9875911 - Semiconductor device and method of forming interposer with opening to contain semiconductor die (2018-01-23),

7. 9865575 - Methods of forming conductive and insulating layers (2018-01-09),

8. 9865554 - Integrated circuit packaging system with under bump metallization and method of manufacture thereof (2018-01-09),

9. 9859200 - Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof (2018-01-02),

10. 9842808 - Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die (2017-12-12),

11. 9748157 - Integrated circuit packaging system with joint assembly and method of manufacture thereof (2017-08-29),

12. 9735113 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2017-08-15),

13. 9721921 - Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form (2017-08-01),

14. 9691707 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2017-06-27),

15. 9679769 - Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof (2017-06-13),

Title: The Innovative Mind of HeeJo Chi

Introduction: HeeJo Chi is a pioneering inventor hailing from Kyoungki-do, South Korea. His relentless pursuit of innovation has led to groundbreaking developments in various fields.

Latest Patents: HeeJo Chi holds several recent patents in the areas of technology and engineering, showcasing his commitment to pushing the boundaries of what is possible.

Career Highlights: Throughout his illustrious career, HeeJo Chi has consistently demonstrated a knack for turning revolutionary ideas into tangible inventions. His work has not only earned him recognition but has also significantly impacted the industries he has been involved in.

Collaborations: HeeJo Chi has collaborated with leading experts and organizations in the innovation space, pooling together knowledge and resources to bring cutting-edge solutions to life. His collaborative efforts have resulted in transformative inventions that have left a lasting mark on the industry.

Conclusion: HeeJo Chi's journey as an inventor is a testament to his unwavering dedication to driving progress through innovation. His inventive spirit and passion for creating have solidified his position as a trailblazer in the world of inventions.

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