The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
May. 29, 2013
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
HeeJo Chi, Yeoju-gun, KR;
HanGil Shin, Seoul, KR;
NamJu Cho, Uiwang-si, KR;
Kyung Moon Kim, Seongnam, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 21/56 (2013.01);
Abstract
An integrated circuit packaging system and method of manufacture thereof includes: a base substrate having a bottom pad; an integrated circuit device mounted on the base substrate; an interposer having a package interconnect mounted on the base substrate, the package interconnect includes an underside base portion having an irregular surface characteristic of a coining process; and an encapsulation between the interposer and the base substrate.