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Seongnam-si, South Korea

HanGil Shin

USPTO Granted Patents = 56 (Patent Applications = 3)

Average Co-Inventor Count = 3.1

ph-index = 15

Forward Citations = 878(Granted Patents)

Forward Citations (Not Self Cited) = 861(Oct 12, 2025)

Inventors with similar research interests:

Location History:

Ichon-si, KR (2010 - 2012)
Seongnam-si, KR (2011 - 2016)
Gyeonggi-do, KR (2011 - 2018)
Seoul, KR (2015 - 2021)

Company Filing History:

55 out of 1,812

Stats Chippac Pte. Ltd.

Jcet Semiconductor (shaoxing) Co., Ltd.

Years Active: 2010-2021

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56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10903183 - Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die (2021-01-26),

2. 10510703 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2019-12-17),

3. 9966335 - Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die (2018-05-08),

4. 9865575 - Methods of forming conductive and insulating layers (2018-01-09),

5. 9842808 - Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die (2017-12-12),

6. 9748157 - Integrated circuit packaging system with joint assembly and method of manufacture thereof (2017-08-29),

7. 9691707 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2017-06-27),

8. 9558965 - Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint (2017-01-31),

9. 9508635 - Methods of forming conductive jumper traces (2016-11-29),

10. 9496152 - Carrier system with multi-tier conductive posts and method of manufacture thereof (2016-11-15),

11. 9406533 - Methods of forming conductive and insulating layers (2016-08-02),

12. 9397050 - Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant (2016-07-19),

13. 9362161 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2016-06-07),

14. 9355939 - Integrated circuit package stacking system with shielding and method of manufacture thereof (2016-05-31),

15. 9312218 - Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die (2016-04-12),

Title: HanGil Shin - Innovative Inventor from Seongnam-si

Introduction: HanGil Shin is a renowned inventor hailing from Seongnam-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: HanGil Shin's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights: With over two decades of experience in the tech industry, HanGil Shin has worked with leading research institutions and tech companies to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, HanGil Shin has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life. His collaborative efforts have resulted in the successful implementation of numerous patented technologies.

Conclusion: HanGil Shin's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs in South Korea and beyond.

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