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HanGil Shin

This inventor holds 56 USPTO granted patents and 5 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Stats Chippac Pte. Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd.. Active years: 2010-2021.

USPTO Granted Patents = 56 (Patent Applications = 5)

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 16

Forward Citations = 889(Granted Patents)

Forward Citations (Not Self Cited) = 861(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Ichon-si, KR (2010 - 2012)
Seongnam-si, KR (2011 - 2016)
Gyeonggi-do, KR (2011 - 2018)
Seoul, KR (2015 - 2021)

Company Filing History:

55 out of 1,842

Stats Chippac Pte. Ltd.

patents

1 out of 15

Jcet Semiconductor (Shaoxing) Co., Ltd.

patents

Years Active: 2010-2021

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Areas of Expertise:

3D Dual Side Die

Vertical Interconnect

Embedded Wafer Level

Conductive Layers

Thermal Management

Leadframe Technology

Interposer Frame

Package Stacking

Through Silicon Via

Solder Balls

Conductive Posts

Insulating Layers

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10903183 - Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die (2021-01-26),

2. 10510703 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2019-12-17),

3. 9966335 - Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die (2018-05-08),

4. 9865575 - Methods of forming conductive and insulating layers (2018-01-09),

5. 9842808 - Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die (2017-12-12),

6. 9748157 - Integrated circuit packaging system with joint assembly and method of manufacture thereof (2017-08-29),

7. 9691707 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2017-06-27),

8. 9558965 - Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint (2017-01-31),

9. 9508635 - Methods of forming conductive jumper traces (2016-11-29),

10. 9496152 - Carrier system with multi-tier conductive posts and method of manufacture thereof (2016-11-15),

11. 9406533 - Methods of forming conductive and insulating layers (2016-08-02),

12. 9397050 - Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant (2016-07-19),

13. 9362161 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2016-06-07),

14. 9355939 - Integrated circuit package stacking system with shielding and method of manufacture thereof (2016-05-31),

15. 9312218 - Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die (2016-04-12),

Title: HanGil Shin - Innovative Inventor from Seongnam-si

Introduction: HanGil Shin is a renowned inventor hailing from Seongnam-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: HanGil Shin's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights: With over two decades of experience in the tech industry, HanGil Shin has worked with leading research institutions and tech companies to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, HanGil Shin has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life. His collaborative efforts have resulted in the successful implementation of numerous patented technologies.

Conclusion: HanGil Shin's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs in South Korea and beyond.

Profile summary based on public USPTO records.

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