The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Mar. 02, 2010
Namju Cho, Uiwang-si, KR;
Heejo Chi, Ichon-si, KR;
Hangil Shin, Seongnam-si, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit package system includes: providing a base package substrate including: forming component contacts on a component side of the base package substrate, forming system contacts on a system side of the base package substrate, and forming a reference voltage circuit between the component contacts and the system contacts; mounting a first integrated circuit die on the component contacts; mounting a lead frame on the first integrated circuit die and coupled to the component contacts; and isolating a conductive shield from the lead frame, the conductive shield coupled to the reference voltage circuit.