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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

NamJu Cho

USPTO Granted Patents = 60 

 

Average Co-Inventor Count = 3.1

ph-index = 16

Forward Citations = 859(Granted Patents)


Inventors with similar research interests:


Location History:

  • Uiwang-si, KR (2011 - 2017)
  • Gyeonggi-do, KR (2011 - 2023)

Company Filing History:

goldMedal53 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal6 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
bronzeMedal1 out of 15 
 
Jcet Semiconductor (shaoxing) Co., Ltd.
 patents

Years Active: 2011-2024

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60 patents (USPTO):Explore Patents
1. 12100663 - Semiconductor device and method of integrating RF antenna interposer with semiconductor package (2024-09-24),
2. 11735530 - Semiconductor device and method of integrating RF antenna interposer with semiconductor package (2023-08-22),
3. 11503451 - Device and method for transmitting signals in plurality of frequency bands (2022-11-15),
4. 10903183 - Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die (2021-01-26),
5. 10573600 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2020-02-25),
6. 10548178 - Method and device for establishing communication connection (2020-01-28),
7. 10510703 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2019-12-17),
8. 10397773 - Method and apparatus for allocating IP address in wireless communication network (2019-08-27),
9. 9966335 - Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die (2018-05-08),
10. 9842808 - Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die (2017-12-12),
11. 9748157 - Integrated circuit packaging system with joint assembly and method of manufacture thereof (2017-08-29),
12. 9735113 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2017-08-15),
13. 9730256 - Method and apparatus for discovering device in wireless communication network (2017-08-08),
14. 9691707 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2017-06-27),
15. 9578494 - Method and apparatus for allocating IP address in wireless communication network (2017-02-21),

Title: The Innovative Journey of NamJu Cho

Introduction: NamJu Cho, a visionary inventor hailing from Gyeonggi-do, South Korea, has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: NamJu Cho holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his versatility and ingenuity in creating cutting-edge solutions for modern challenges.

Career Highlights: With a career spanning over two decades, NamJu Cho has worked with leading tech companies, research institutions, and universities to develop innovative technologies that have revolutionized various industries.

Collaborations: Throughout his career, NamJu Cho has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge exchange to push the boundaries of technological advancement.

Conclusion: NamJu Cho's passion for innovation, coupled with his relentless pursuit of excellence, has established him as a prominent figure in the world of inventors, inspiring the next generation of innovators to dream big and create a better future through technology.

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