NamJu Cho

This inventor holds 60 USPTO granted patents and 9 published patent applications and 2 EPO patents, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Stats Chippac Pte. Ltd., Samsung Electronics Co., Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd.. Active years: 2011-2024.

USPTO Granted Patents = 60 (Patent Applications = 9)

% Patents Active = 100.0

EPO Patents = 2 (Patent Applications = 2)

Average Co-Inventor Count = 3.1

ph-index = 16

Forward Citations = 871(Granted Patents)

Forward Citations (Not Self Cited) = 845(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Uiwang-si, KR (2011 - 2017)
Gyeonggi-do, KR (2011 - 2023)

Company Filing History:

53 out of 1,842

Stats Chippac Pte. Ltd.

patents

6 out of 132,108

Samsung Electronics Co., Ltd.

patents

1 out of 15

Jcet Semiconductor (Shaoxing) Co., Ltd.

patents

Years Active: 2011-2024

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Areas of Expertise:

Integrated Circuit

RF Antenna

WLCSP

3D Packaging

Vertical Interconnect

Thermal Management

Conductive Posts

Die Embedded

Interposer Frame

Redistribution Layer

Package Stacking

IP Address Allocation

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12100663 - Semiconductor device and method of integrating RF antenna interposer with semiconductor package (2024-09-24),

2. 11735530 - Semiconductor device and method of integrating RF antenna interposer with semiconductor package (2023-08-22),

3. 11503451 - Device and method for transmitting signals in plurality of frequency bands (2022-11-15),

4. 10903183 - Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die (2021-01-26),

5. 10573600 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2020-02-25),

6. 10548178 - Method and device for establishing communication connection (2020-01-28),

7. 10510703 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2019-12-17),

8. 10397773 - Method and apparatus for allocating IP address in wireless communication network (2019-08-27),

9. 9966335 - Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die (2018-05-08),

10. 9842808 - Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die (2017-12-12),

11. 9748157 - Integrated circuit packaging system with joint assembly and method of manufacture thereof (2017-08-29),

12. 9735113 - Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP (2017-08-15),

13. 9730256 - Method and apparatus for discovering device in wireless communication network (2017-08-08),

14. 9691707 - Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package (2017-06-27),

15. 9578494 - Method and apparatus for allocating IP address in wireless communication network (2017-02-21),

Title: The Innovative Journey of NamJu Cho

Introduction: NamJu Cho, a visionary inventor hailing from Gyeonggi-do, South Korea, has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: NamJu Cho holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his versatility and ingenuity in creating cutting-edge solutions for modern challenges.

Career Highlights: With a career spanning over two decades, NamJu Cho has worked with leading tech companies, research institutions, and universities to develop innovative technologies that have revolutionized various industries.

Collaborations: Throughout his career, NamJu Cho has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge exchange to push the boundaries of technological advancement.

Conclusion: NamJu Cho's passion for innovation, coupled with his relentless pursuit of excellence, has established him as a prominent figure in the world of inventors, inspiring the next generation of innovators to dream big and create a better future through technology.