Stats Chippac Pte. Ltd.

Samsung Electronics Co., Ltd.

Jcet Semiconductor (shaoxing) Co., Ltd.

NamJu Cho

HeeJo Chi

HanGil Shin

Jongmu Choi

Hakkwan Kim

Changsoon Kim

Ki Youn Jang

Soonho Lee

Kyung Moon Kim

YoungCheol Kim

ChanHoon Ko

Byunghoon Seo

Chanki Cho

JunWoo Myung

HaengCheol Choi

Seng Guan Chow

Heap Hoe Kuan

Doosuk Kang

Rui Huang

Bu-Seop Jung

Buseop Jung

Sunkey Lee

WonJun Ko

Taewoo Lee

HyungSang Park

Hyejung Bang

YeongIm Park

Dooho Lee

Bumjib Kim

A semiconductor device has a substrate and a first electrical component disposed over a first surface of the substrate. An RF antenna interposer is disposed over the substrate with the first electrical component connected to a first antenna disposed on a surface of the antenna interposer. An area of the antenna interposer is substantially the same as an area of the substrate. The first antenna disposed on the surface of the antenna interposer has a plurality of islands of conductive material. Alternatively, the first antenna disposed on the surface of the antenna interposer has a spiral shape of conductive material. A second antenna can be disposed on the surface of the antenna interposer connected to a second electrical component disposed over the substrate. A second electrical component can be disposed over a second surface of the substrate opposite the first surface of the substrate.

Semiconductor device and method of integrating RF antenna interposer with semiconductor package

Disclosed is an electronic device. In addition, it is possible to implement various embodiment understood through the present disclosure. The electronic device transmits a first signal in a first frequency band including at least one of a synchronization beacon frame, a service discovery frame, or an action frame based on an NAN protocol at a first interval for a series of first durations, and transmits a second signal in a second frequency band including at least one of the synchronization beacon frame, the service discovery frame, or the action frame based on the NAN protocol at a second interval for a series of second durations.

Device and method for transmitting signals in plurality of frequency bands

A semiconductor device has a leadframe with a plurality of bodies extending from the base plate. A first semiconductor die is mounted to the base plate of the leadframe between the bodies. An encapsulant is deposited over the first semiconductor die and base plate and around the bodies of the leadframe. A portion of the encapsulant over the bodies of the leadframe is removed to form first openings in the encapsulant that expose the bodies. An interconnect structure is formed over the encapsulant and extending into the first openings to the bodies of the leadframe. The leadframe and bodies are removed to form second openings in the encapsulant corresponding to space previously occupied by the bodies to expose the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with bumps extending into the second openings of the encapsulant to electrically connect to the interconnect structure.

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

An electronic device includes a communication module configured to support a plurality of communication channels that include a first communication channel and a second communication channel, and a processor operatively coupled with the communication module. The processor is configured to use the first communication channel to establish a first communication connection between the electronic device and another electronic device, while the first communication connection has been established, to check a second communication connection between the electronic device and a first access point using the second communication channel, and based on the checking, to change a channel for the first communication connection from the first communication channel to the second communication channel.

Method and device for establishing communication connection

A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating film is disposed between the semiconductor die and substrate. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The bumps include a copper core encapsulated within copper plating. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The substrate includes a conductive layer formed in the substrate and coupled to the bumps. The semiconductor die is disposed between the bumps of the substrate. The bumps and the semiconductor die are embedded within the first prefabricated insulating film. A portion of the first prefabricated insulating film is removed to expose the bumps. The bumps electrically connect the substrate to the interconnect structure.

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

A method and apparatus allocates an IP address between terminals in a wireless communication network in which terminals directly communicate with each other in a wireless scheme without an AP. The method for allocating an Internet Protocol (IP) address of a wireless terminal capable of performing P2P communication, includes a discovery step of discovering at least one external terminal capable of performing the P2P communication and connecting with the at least one discovered external terminal by the wireless terminal; and a negotiation step of negotiating and determining with the external terminal which external terminals become a group owner and a group client in a P2P group, respectively by the wireless terminal. One of the discovery step and the negotiation step includes transmitting an IP address to be allocated to the group client to the external terminal from the wireless terminal.

Method and apparatus for allocating IP address in wireless communication network

A semiconductor device has an interposer frame mounted over a carrier. A semiconductor die has an active surface and bumps formed over the active surface. The semiconductor die can be mounted within a die opening of the interposer frame or over the interposer frame. Stacked semiconductor die can also be mounted within the die opening of the interposer frame or over the interposer frame. Bond wires or bumps are formed between the semiconductor die and interposer frame. An encapsulant is deposited over the interposer frame and semiconductor die. An interconnect structure is formed over the encapsulant and bumps of the first semiconductor die. An electronic component, such as a discrete passive device, semiconductor die, or stacked semiconductor die, is mounted over the semiconductor die and interposer frame. The electronic component has an I/O count less than an I/O count of the semiconductor die.

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

A semiconductor device has a plurality of semiconductor die or components mounted over a carrier. A leadframe is mounted over the carrier between the semiconductor die. The leadframe has a plate and bodies extending from the plate. The bodies of the leadframe are disposed around a perimeter of the semiconductor die. An encapsulant is deposited over the carrier, leadframe, and semiconductor die. A plurality of conductive vias is formed through the encapsulant and electrically connected to the bodies of the leadframe and contact pads on the semiconductor die. An interconnect structure is formed over the encapsulant and electrically connected to the conductive vias. A first channel is formed through the interconnect structure, encapsulant, leadframe, and partially through the carrier. The carrier is removed to singulate the semiconductor die. A second channel is formed through the plate of the leadframe to physically separate the bodies of the leadframe.

Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die

An integrated circuit packaging system and method of manufacture thereof includes: a base substrate having a bottom pad; an integrated circuit device mounted on the base substrate; an interposer having a package interconnect mounted on the base substrate, the package interconnect includes an underside base portion having an irregular surface characteristic of a coining process; and an encapsulation between the interposer and the base substrate.

Integrated circuit packaging system with joint assembly and method of manufacture thereof

A method and apparatus for discovering a device without an access point (AP) to perform P2P communication in a wireless communication network includes: receiving a probe request frame from another P2P device; determining whether a message requesting at least one of a phone number and user identification information is included in the received probe request frame; and transmitting a probe response frame including at least one of the phone number and the user identification information to the another P2P device when the message is included in the probe request frame.

Method and apparatus for discovering device in wireless communication network

A method and apparatus allocates an IP address between terminals in a wireless communication network in which terminals directly communicate with each other in a wireless scheme without an AP. The method for allocating an Internet Protocol (IP) address of a wireless terminal capable of performing P2P communication, includes

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Gyeonggi-do, South Korea

NamJu Cho