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For the Inventor, By the Inventor

Los Gatos, CA, United States of America

Yan Xun Xue

USPTO Granted Patents = 96 

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 236(Granted Patents)

Forward Citations (Not Self Cited) = 220(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal80 out of 753 
 
Alpha Omega Semiconductor Inc.
 patents
silverMedal8 out of 60 
 
Alpha and Omega Semiconductor International LP
 patents
bronzeMedal7 out of 132 
 
Alpha and Omega Semiconductor (cayman) Ltd.
 patents
4. 1 out of 1 
 
Alpha and Omega Semiconductor (cayman) Ltd. Grand
 patent

Years Active: 2011-2025

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Areas of Expertise:
Semiconductor Packaging
Wafer Level Packaging
Power Semiconductor Devices
Chip Scale Package
Lead Frame Technology
Multi-Chip Semiconductor Device
Battery Protection Package
Field-Effect Transistors
Hybrid Packaging
Molded Chip Scale Package
Thick Bottom Metal
Flipped MOSFET
96 patents (USPTO):Explore Patents
1. 12261101 - Semiconductor package having wettable lead flanks and tie bars and method of making the same (2025-03-25),
2. 12142548 - Semiconductor package having mold locking feature (2024-11-12),
3. 11721665 - Wafer level chip scale semiconductor package (2023-08-08),
4. 11699627 - DMOS FET chip scale package and method of making the same (2023-07-11),
5. 11688671 - Semiconductor package having a lead frame including die paddles and method of making the same (2023-06-27),
6. 11581195 - Semiconductor package having wettable lead flank and method of making the same (2023-02-14),
7. 11430762 - Method for semi-wafer level packaging (2022-08-30),
8. 11222858 - Semiconductor package having enlarged gate pad and method of making the same (2022-01-11),
9. 11094617 - Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same (2021-08-17),
10. 11069604 - Semiconductor package and method of making the same (2021-07-20),
11. 10991680 - Common source land grid array package (2021-04-27),
12. 10141264 - Method and structure for wafer level packaging with large contact area (2018-11-27),
13. 10043736 - Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures (2018-08-07),
14. 9966328 - Semiconductor power device having single in-line lead module and method of making the same (2018-05-08),
15. 9960119 - Method and structure for wafer level packaging with large contact area (2018-05-01),

Title: Yan Xun Xue: Pioneering Innovation in Semiconductor Technology

Introduction:

Yan Xun Xue, a visionary inventor based in Los Gatos, CA, has carved out a reputation as a trailblazer in the world of inventions, with a keen focus on pushing the boundaries of technology with her innovative creations.

Latest Patents:

Among her impressive portfolio of 94 patents, two recent groundbreaking inventions stand out. The first one is the "Wafer level chip scale semiconductor package," revolutionizing semiconductor packaging with its intricate design. The second patent, "DMOS FET chip scale package," showcases her expertise in semiconductor field-effect transistors.

Career Highlights:

Yan Xun Xue has made significant contributions to the semiconductor industry through her work at Alpha & Omega Semiconductor Corporation and its subsidiary Alpha and Omega Semiconductor (Cayman) Ltd. Her innovative spirit and dedication to advancing technology have been instrumental in shaping the landscape of modern semiconductor devices.

Collaborations:

Throughout her career, Yan Xun Xue has collaborated with esteemed professionals in the industry, including Jun Lu and Yueh-Se Ho. These collaborations have led to the creation of cutting-edge technologies, further solidifying her position as a leader in the field of semiconductor innovation.

Conclusion:

Yan Xun Xue's passion for innovation, coupled with her relentless drive to push the boundaries of technology, has positioned her as a true pioneer in the world of inventions. Her groundbreaking patents and collaborative efforts underscore her dedication to shaping the future of semiconductor technology, making her a standout figure in the realm of innovation.

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