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For the Inventor, By the Inventor

Los Gatos, CA, United States of America

Yan Xun Xue

This inventor holds 102 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Packaging (CPC class H01L2924-13091). Top assignees: Alpha Omega Semiconductor Inc., Alpha and Omega Semiconductor International LP, Alpha and Omega Semiconductor (Cayman) Ltd.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yan Xun Xue. Retrieved from https://idiyas.com/inventor/yan-xun-xue

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 102 

% Patents Active = 91.2

Average Co-Inventor Count = 3.1

ph-index = 8

Forward Citations = 247(Granted Patents)

Forward Citations (Not Self Cited) = 220(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal80 out of 753 
 
Alpha Omega Semiconductor Inc.
 patents
silverMedal13 out of 79 
 
Alpha and Omega Semiconductor International LP
 patents
bronzeMedal7 out of 132 
 
Alpha and Omega Semiconductor (Cayman) Ltd.
 patents
4. 1 out of 1 
 
Alpha and Omega Semiconductor (Cayman) Ltd. Grand
 patent
where one patent can have more than one assignee

Years Active: 2011-2026

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Areas of Expertise:
Wafer Level Packaging
Chip Scale Package
Power Semiconductor
Molded Package
Lead Frame
Parasitic Inductance
Gate Pad
Multi-Chip Device
Electrode Connection
Thick Bottom Metal
Battery Protection
Hybrid Packaging
102 patents (USPTO):Explore Patents
1. 12765400 - Semiconductor package having partially plated lead flank and method of making the same (2026-10-13),
2. 12757755 - Semiconductor package having lead frame with slanted sections (2026-10-06),
3. 12677715 - Apparatus having surface mount packages having co-packed field effect transistors (2026-07-07),
4. 12677712 - Semiconductor package having multiple redistribution layers and method of making the same (2026-07-07),
5. 12575467 - Semiconductor package having reduced parasitic inductance (2026-03-10),
6. 12568845 - Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same (2026-03-03),
7. 12261101 - Semiconductor package having wettable lead flanks and tie bars and method of making the same (2025-03-25),
8. 12142548 - Semiconductor package having mold locking feature (2024-11-12),
9. 11721665 - Wafer level chip scale semiconductor package (2023-08-08),
10. 11699627 - DMOS FET chip scale package and method of making the same (2023-07-11),
11. 11688671 - Semiconductor package having a lead frame including die paddles and method of making the same (2023-06-27),
12. 11581195 - Semiconductor package having wettable lead flank and method of making the same (2023-02-14),
13. 11430762 - Method for semi-wafer level packaging (2022-08-30),
14. 11222858 - Semiconductor package having enlarged gate pad and method of making the same (2022-01-11),
15. 11094617 - Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same (2021-08-17),

Title: Yan Xun Xue: Pioneering Innovation in Semiconductor Technology

Introduction:

Yan Xun Xue, a visionary inventor based in Los Gatos, CA, has carved out a reputation as a trailblazer in the world of inventions, with a keen focus on pushing the boundaries of technology with her innovative creations.

Latest Patents:

Among her impressive portfolio of 94 patents, two recent groundbreaking inventions stand out. The first one is the "Wafer level chip scale semiconductor package," revolutionizing semiconductor packaging with its intricate design. The second patent, "DMOS FET chip scale package," showcases her expertise in semiconductor field-effect transistors.

Career Highlights:

Yan Xun Xue has made significant contributions to the semiconductor industry through her work at Alpha & Omega Semiconductor Corporation and its subsidiary Alpha and Omega Semiconductor (Cayman) Ltd. Her innovative spirit and dedication to advancing technology have been instrumental in shaping the landscape of modern semiconductor devices.

Collaborations:

Throughout her career, Yan Xun Xue has collaborated with esteemed professionals in the industry, including Jun Lu and Yueh-Se Ho. These collaborations have led to the creation of cutting-edge technologies, further solidifying her position as a leader in the field of semiconductor innovation.

Conclusion:

Yan Xun Xue's passion for innovation, coupled with her relentless drive to push the boundaries of technology, has positioned her as a true pioneer in the world of inventions. Her groundbreaking patents and collaborative efforts underscore her dedication to shaping the future of semiconductor technology, making her a standout figure in the realm of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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