The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Sep. 29, 2023
Alpha and Omega Semiconductor International Lp, Toronto, CA;
Zhiqiang Niu, Santa Clara, CA (US);
Xiao Zhang, Sunnyvale, CA (US);
Long-Ching Wang, Cupertino, CA (US);
Guobing Shen, Shanghai, CN;
Yan Xun Xue, Los Gatos, CA (US);
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP, Toronto, CA;
Abstract
A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises a top plate, a plurality of drain pads, a plurality of slanted sections, a gate pad, and a plurality of source pads. The top plate of the lead frame comprises a thicker region and a thinner region. Each slanted section of the plurality of slanted sections connects a respective drain pad of the plurality of drain pads to the top plate. A respective side surface of each drain pad of the plurality of drain pads is exposed from a side surface of the molding encapsulation. A respective bottom surface of each drain pad of the plurality of drain pads is exposed from a bottom surface of the molding encapsulation. A top surface of the thicker region is exposed from a top surface of the molding encapsulation.