This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Alpha and Omega Semiconductor International LP. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Xiao Zhang and Semiconductor Packaging Innovation.
Introduction
Xiao Zhang is an inventor associated with Sunnyvale, California, and Alpha and Omega Semiconductor International LP. The available information credits Zhang with 1 patent concerning semiconductor packaging.
Latest Patents
Zhang’s listed patent, “Semiconductor Package Having Lead Frame with Slanted Sections,” describes a semiconductor package built around a lead frame, a chip, and a molding encapsulation. The lead frame includes a top plate with thicker and thinner regions, drain pads connected to the top plate by slanted sections, a gate pad, and source pads. The design exposes the drain pads’ side and bottom surfaces, as well as the thicker region’s top surface, through corresponding surfaces of the molding encapsulation.
Career Highlights
The patent reflects Zhang’s work on lead-frame structure and the arrangement of exposed surfaces in semiconductor packages. Zhang is associated with Alpha and Omega Semiconductor International LP.
Collaborations
Zhiqiang Niu and Long-Ching Wang are identified as Zhang’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Xiao Zhang’s listed patent focuses on a semiconductor package with slanted lead-frame sections and selectively exposed surfaces, highlighting a contribution to semiconductor packaging design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile