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Jun Lu

USPTO Granted Patents = 106 (Patent Applications = 6)

Average Co-Inventor Count = 4.2

ph-index = 11

Forward Citations = 404(Granted Patents)

Forward Citations (Not Self Cited) = 384(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

86 out of 752

Alpha Omega Semiconductor Inc.

patents

11 out of 132

Alpha and Omega Semiconductor (cayman) Ltd.

patents

5 out of 59

Alpha and Omega Semiconductor International LP

6. 1 out of 832,843

Other

patents

Years Active: 2003-2025

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Areas of Expertise:

Semiconductor Power Module

Chip Scale Package

Thin Substrate Technology

Dmos Fet Packaging

Molded Intelligent Power Module

Multi-Chip Semiconductor Device

Battery Protection Package

Hybrid Packaging Techniques

Power Semiconductor Device

Flipped Mosfet Chip

Embedded Package Solutions

Low-Rdson Vertical Power Mosfet

106 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438069 - Semiconductor power module package having lead frame anchored bars (2025-10-07),

2. 12243808 - Chip scale package (CSP) semiconductor device having thin substrate (2025-03-04),

3. 11784141 - Semiconductor package having thin substrate and method of making the same (2023-10-10),

4. 11699627 - DMOS FET chip scale package and method of making the same (2023-07-11),

5. 11495548 - Semiconductor package having thin substrate and method of making the same (2022-11-08),

6. 10991660 - Semiconductor package having high mechanical strength (2021-04-27),

7. 10600727 - Molded intelligent power module for motors (2020-03-24),

8. 10504823 - Power semiconductor device with small contact footprint and the preparation method (2019-12-10),

9. 10396019 - Molded intelligent power module and method of making the same (2019-08-27),

10. 10177080 - Molded intelligent power module (2019-01-08),

11. 10141249 - Molded intelligent power module and method of making the same (2018-11-27),

12. 10043736 - Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures (2018-08-07),

13. 9929076 - Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes (2018-03-27),

14. 9854686 - Preparation method of a thin power device (2017-12-26),

15. 9786583 - Power semiconductor package device having locking mechanism, and preparation method thereof (2017-10-10),

As an AI assistant at idiyas.com, I can craft an insightful article about the accomplished inventor Jun Lu and his unwavering commitment to driving innovation in San Jose, CA (US).

Title: Jun Lu: Pioneering Sustainable Innovation for a Better Tomorrow

Introduction:

Jun Lu is a prominent figure in the world of inventors, revered for his dedication to pushing the boundaries of innovation and his profound commitment to creating a sustainable future through his impactful inventions. With a whopping 104 patents to his name, Jun Lu stands out as a visionary innovator whose work continues to inspire the next generation of creative minds.

Latest Patents:

Among his latest patents is the "Semiconductor package having thin substrate and method of making the same," where Jun Lu introduces a semiconductor package with a cutting-edge design aimed at efficiency and performance. Additionally, his "DMOS FET chip scale package and method of making the same" patent showcases his expertise in semiconductor technology and advanced manufacturing processes.

Career Highlights:

Throughout his illustrious career, Jun Lu has made significant contributions to the field of semiconductor technologies. Notably, he has worked with renowned companies such as Alpha & Omega Semiconductor Corporation, where his innovative spirit and technical acumen have played a pivotal role in driving technological advancements.

Collaborations:

Jun Lu's collaborative spirit is evident through his work alongside esteemed coworkers like Yan Xun Xue and Hamza Yilmaz. Together, they have synergized their expertise to develop groundbreaking solutions that have reshaped the landscape of semiconductor packaging and design.

Conclusion:

In conclusion, Jun Lu's remarkable journey as an inventor underscores his relentless pursuit of innovation and sustainability. His trailblazing inventions not only embody his technical prowess but also reflect his deep-seated commitment to creating a better world through transformative technologies. Jun Lu's legacy as a visionary inventor continues to inspire and pave the way for future innovators to follow in his pioneering footsteps.

This text is generated by artificial intelligence and may not be accurate.

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