The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Mar. 13, 2015
Alpha and Omega Semiconductor (Cayman), Ltd, Sunnyvale, CA (US);
Yuping Gong, Shanghai, CN;
Yan Xun Xue, Los Gatos, CA (US);
Ming-Chen Lu, Shanghai, CN;
Ping Huang, Shanghai, CN;
Jun Lu, San Jose, CA (US);
Hamza Yilmaz, Saratoga, CA (US);
ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD., Grand Cayman, KY;
Abstract
A preparation method of a thin power device comprising the steps of steps S1, S2 and S3. In step S1, a substrate is provided. The substrate comprises a first set of first contact pads and a second set of second contact pads arranged at a front surface and a back surface of the substrate respectively. Each first contact pad of the first set of contact pads is electrically connected with a respective second contact pad of the second set of contact pads via a respective interconnecting structure formed inside the substrate. A through opening is formed in the substrate aligning with a third contact pad attached to the back surface of the substrate. The third contact pad is not electrically connected with the first set of contact pads. In step S2, a semiconductor chip is embedded into the through opening. A back metal layer at a back surface of the semiconductor chip is attached to the third contact pad. In step S3, a respective electrode of a plurality of electrodes at a front surface of the semiconductor chip is electrically connected with said each first contact pad of the first set of contact pads via a respective conductive structure of a plurality of conductive structures.