The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jul. 06, 2015
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
SooSan Park, Seoul, KR;
KyuSang Kim, Suwon-si, KR;
YeoChan Ko, Namyangju-si, KR;
KeoChang Lee, Icheon-si, KR;
HeeJo Chi, Yeoju-gun, KR;
HeeSoo Lee, Anyang-si, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/482 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/4828 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 24/92 (2013.01); H01L 23/3128 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.