The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Sep. 25, 2013
Applicants:
OH Han Kim, Icheon-si, KR;
Sell Jung, Seoul, KR;
Heesoo Lee, Anyang-si, KR;
Jae Han Chung, Yongin-si, KR;
Youngchul Kim, Youngin-si, KR;
Inventors:
Oh Han Kim, Icheon-si, KR;
Sell Jung, Seoul, KR;
HeeSoo Lee, Anyang-si, KR;
Jae Han Chung, Yongin-si, KR;
YoungChul Kim, Youngin-si, KR;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 25/065 (2013.01);
Abstract
An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.