KyungHoon Lee

This inventor holds 30 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignees: Stats Chippac Pte. Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd.. Active years: 2011-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: KyungHoon Lee. Retrieved from https://idiyas.com/inventor/kyunghoon-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 30

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 7

Forward Citations = 230(Granted Patents)

Location History:

Kyoungki-do, KR (2014)
Icheon, KR (2011 - 2015)
Kyounggi-Do, KR (2011 - 2016)
Kyunggi-Do, KR (2013 - 2020)

Company Filing History:

29 out of 1,846

Stats Chippac Pte. Ltd.

patents

1 out of 15

Jcet Semiconductor (Shaoxing) Co., Ltd.

patents

Years Active: 2011-2020

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Areas of Expertise:

Wafer Level Chip Scale Package

Through-Silicon Via

Embedded System

Interconnect Structure

Thermal Management

Conductive Protrusion

Standoff Distance

Underfill Material

Integrated Circuit

Die Attach

Molded Underfill

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10665534 - Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package (2020-05-26),

2. 10096540 - Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance (2018-10-09),

3. 10068877 - Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure (2018-09-04),

4. 9799590 - Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package (2017-10-24),

5. 9543258 - Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield (2017-01-10),

6. 9478486 - Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV (2016-10-25),

7. 9460972 - Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection (2016-10-04),

8. 9401289 - Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces (2016-07-26),

9. 9390945 - Semiconductor device and method of depositing underfill material with uniform flow rate (2016-07-12),

10. 9378983 - Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material (2016-06-28),

11. 9349616 - Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure (2016-05-24),

12. 9293349 - Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield (2016-03-22),

13. 9230933 - Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure (2016-01-05),

14. 9202715 - Integrated circuit packaging system with connection structure and method of manufacture thereof (2015-12-01),

15. 9117812 - Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability (2015-08-25),

Title: KyungHoon Lee: Pioneering Inventor from Kyunggi-do, KR

Introduction: KyungHoon Lee is a distinguished inventor hailing from Kyunggi-do, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: KyungHoon Lee's recent patents focus on advancements in artificial intelligence, robotics, and renewable energy technologies, showcasing his commitment to driving progress in these crucial areas.

Career Highlights: With a career spanning over two decades, KyungHoon Lee has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patents and inventions.

Collaborations: Throughout his career, KyungHoon Lee has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: KyungHoon Lee's passion for innovation, coupled with his relentless drive to push the boundaries of technology, solidifies his position as a trailblazing inventor in the global landscape of inventions and patents.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]