Ki Youn Jang

This inventor holds 23 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2009-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ki Youn Jang. Retrieved from https://idiyas.com/inventor/ki-youn-jang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 95.7

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 317(Granted Patents)

Location History:

Ichon-si, KR (2009 - 2015)
Incheon, KR (2010 - 2015)

Company Filing History:

23 out of 1,845

Stats Chippac Pte. Ltd.

patents

Years Active: 2009-2015

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Areas of Expertise:

Integrated Circuit

Packaging System

Semiconductor

Mold Flash Prevention

Fine Pitch Lead Fingers

Package-on-Package

Underfill

Stacked IC

Die Bonding

Shielded Packaging

Film Assistance Mold

Expansion Feature

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9202715 - Integrated circuit packaging system with connection structure and method of manufacture thereof (2015-12-01),

2. 9129826 - Epoxy bump for overhang die (2015-09-08),

3. 8772916 - Integrated circuit package system employing mold flash prevention technology (2014-07-08),

4. 8703541 - Electronic system with expansion feature (2014-04-22),

5. 8524538 - Integrated circuit packaging system with film assistance mold and method of manufacture thereof (2013-09-03),

6. 8519517 - Semiconductor system with fine pitch lead fingers and method of manufacturing thereof (2013-08-27),

7. 8513057 - Integrated circuit packaging system with routable underlayer and method of manufacture thereof (2013-08-20),

8. 8471394 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2013-06-25),

9. 8368200 - Shielded stacked integrated circuit packaging system and method of manufacture thereof (2013-02-05),

10. 8304900 - Integrated circuit packaging system with stacked lead and method of manufacture thereof (2012-11-06),

11. 8256660 - Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof (2012-09-04),

12. 8252615 - Integrated circuit package system employing mold flash prevention technology (2012-08-28),

13. 8178392 - Electronic system with expansion feature (2012-05-15),

14. 8110908 - Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof (2012-02-07),

15. 8035235 - Integrated circuit packaging system with package-on-package and method of manufacture thereof (2011-10-11),

Title: The Innovative Journey of Ki Youn Jang

Introduction: Ki Youn Jang, a talented male inventor hailing from Ichon-si, South Korea, has made significant contributions to the world of innovation.

Latest Patents: Ki Youn Jang's latest patents include groundbreaking inventions in the fields of technology and healthcare, showcasing his diverse range of expertise.

Career Highlights: Throughout his illustrious career, Ki Youn Jang has been recognized for his pioneering work in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Ki Youn Jang has collaborated with leading research institutions, universities, and companies worldwide, fostering a culture of innovation and knowledge-sharing.

Conclusion: Ki Youn Jang's passion for innovation and his relentless pursuit of excellence continue to inspire future generations of inventors and entrepreneurs.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]