The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Mar. 21, 2011
Applicants:
Hun Teak Lee, Ichon, KR;
Jong Kook Kim, Suwon, KR;
Chulsik Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Inventors:
Hun Teak Lee, Ichon, KR;
Jong Kook Kim, Suwon, KR;
ChulSik Kim, Ichon-si, KR;
Ki Youn Jang, Ichon-si, KR;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; and an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.