Company Filing History:

9 out of 1,812

Stats Chippac Pte. Ltd.

Years Active: 2007-2015

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9129826 - Epoxy bump for overhang die (2015-09-08),

2. 8519517 - Semiconductor system with fine pitch lead fingers and method of manufacturing thereof (2013-08-27),

3. 8256660 - Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof (2012-09-04),

4. 7909233 - Method of manufacturing a semiconductor package with fine pitch lead fingers (2011-03-22),

5. 7731078 - Semiconductor system with fine pitch lead fingers (2010-06-08),

6. 7652382 - Micro chip-scale-package system (2010-01-26),

7. 7429798 - Integrated circuit package-in-package system (2008-09-30),

8. 7407080 - Wire bond capillary tip (2008-08-05),

9. 7298052 - Micro chip-scale-package system (2007-11-20),

10. 7271496 - Integrated circuit package-in-package system (2007-09-18),

Title: Innovations of Jong Kook Kim

Introduction

Jong Kook Kim is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the efficiency and functionality of semiconductor assemblies.

Latest Patents

One of his latest patents is titled "Epoxy bump for overhang die." This invention involves a semiconductor assembly that utilizes discrete bumps made of a polymer, such as an electrically nonconductive epoxy, which are strategically placed between the substrate and the elevated element. Another notable patent is "Semiconductor system with fine pitch lead fingers and method of manufacturing thereof." This patent describes a semiconductor package system that includes an electrical substrate with a contact pad, a support structure with a lead finger, and an encapsulant that enhances the overall design and functionality of the semiconductor package.

Career Highlights

Throughout his career, Jong Kook Kim has worked with notable companies in the semiconductor industry, including Stats Chippac Pte. Ltd. and Chippac, Inc. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in semiconductor manufacturing.

Collaborations

Jong Kook Kim has collaborated with several talented individuals in his field, including Hun Teak Lee and ChulSik Kim. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a spirit of innovation.

Conclusion

Jong Kook Kim's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor systems.

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