The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
May. 30, 2006
Hun Teak Lee, Ichon-si, KR;
Jong Kook Kim, Jungja-dong, KR;
Chul Sik Kim, Ichon-si, KR;
Ki Youn Jang, Incheon, KR;
Hun Teak Lee, Ichon-si, KR;
Jong Kook Kim, Jungja-dong, KR;
Chul Sik Kim, Ichon-si, KR;
Ki Youn Jang, Incheon, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package) with the discrete bump directly under bond sites on the elevated element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile