Chul Sik Kim

Title: The Innovations of Chul Sik Kim

Introduction

Chul Sik Kim is a notable inventor based in Ichon-si, South Korea. He has made significant contributions to the field of semiconductor assembly, particularly with his innovative patent that addresses challenges in the industry.

Latest Patents

One of his key inventions is the patent for an "Epoxy bump for overhang die." This invention involves the use of discrete bumps made of a polymer, such as an electrically nonconductive epoxy, which are strategically placed between the upper surface of a substrate and the lower surface of an overhanging part of an elevated element. This design ensures that the discrete bumps are directly under bond sites on the elevated element, enhancing the reliability and performance of semiconductor assemblies. Chul Sik Kim holds 1 patent for this innovative solution.

Career Highlights

Chul Sik Kim is currently employed at Stats Chippac Pte. Ltd., a company known for its expertise in semiconductor packaging and assembly. His work at this organization has allowed him to further develop his skills and contribute to advancements in the field.

Collaborations

Throughout his career, Chul Sik Kim has collaborated with talented individuals such as Hun Teak Lee and Jong Kook Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chul Sik Kim's contributions to semiconductor technology through his patent for epoxy bumps demonstrate his commitment to innovation in the industry. His work continues to influence the field and showcases the importance of inventive solutions in modern technology.