The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Oct. 22, 2004
Kenny Lee, Seoul, KR;
Hun-teak Lee, Ichon-si, KR;
Jong Kook Kim, Suwon-si, KR;
Chulsik Kim, Ichon-si, KR;
Ki-youn Jang, Incheon, KR;
Kenny Lee, Seoul, KR;
Hun-Teak Lee, Ichon-si, KR;
Jong Kook Kim, Suwon-si, KR;
Chulsik Kim, Ichon-si, KR;
Ki-Youn Jang, Incheon, KR;
Chippac, Inc., Fremont, CA (US);
Abstract
A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.