Company Filing History:
Years Active: 2008-2016
Title: Innovations by Inventor Kenny Lee
Introduction
Kenny Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Kenny Lee's latest patents include a semiconductor device and a method of calibrating a warpage testing system to accurately measure semiconductor package warpage. This innovative warpage test system utilizes a calibration block to ensure precise measurements over a temperature profile. The calibration block consists of two different metal blocks with varying coefficients of thermal expansion (CTE). This design allows for accurate compensation of warpage measurements in semiconductor packages.
Another notable patent is for an integrated circuit packaging system with interposer interconnections and a method of manufacture. This method involves several steps, including the mounting of a routing structure above the integrated circuit and the formation of encapsulation that covers the components while leaving certain surfaces exposed. This approach enhances the functionality and efficiency of integrated circuit packaging.
Career Highlights
Kenny Lee has worked with several notable companies in the semiconductor industry, including Stats Chippac Pte. Ltd. and Chippac, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Throughout his career, Kenny has collaborated with talented individuals such as A Leam Choi and In Sang Yoon. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.
Conclusion
Kenny Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of semiconductor devices and packaging systems.