The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Dec. 13, 2011
A Leam Choi, Ichon-si, KR;
Kenny Lee, Seoul, KR;
IN Sang Yoon, Ichon-si, KR;
Hangil Shin, Seongnam-si, KR;
A Leam Choi, Ichon-si, KR;
Kenny Lee, Seoul, KR;
In Sang Yoon, Ichon-si, KR;
HanGil Shin, Seongnam-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component.